From: David S Kung <kung@us.ibm.com>
Date: Tue, Jun 8, 2010 at 12:23 PM
Subject: EDA Roadmap Workshop at the DAC (it's free)
To: DATC members <DATC_members%IBMUS@us.ibm.com>
There will be a an EDA Roadmap workshop at the DAC (on Monday) hosted by Dr. Juan-antonio Carballo (DATC past chair) and Prof. Andrew Kahng. The EDA Roadmap Workshop at DAC 2010 is the second in a series of forums for deep discussion around roadmapping issues related to the EDA industry. Leaders from semiconductor companies, consortia, and academia will huddle to analyze the need and state of the EDA sector's roadmapping efforts, with the goal of crafting a blank-sheet view of EDA roadmapping for the next 15 years. You can check out last year's presentation at http://vlsicad.ucsd.edu/EDARoadmapWorkshop
This event is guaranteed to be thought provoking and there is no charge for attendance. I will be giving my perspective on EDA roadmaps. Hope to see you there.
David
David S. Kung
Senior Manager, Design Automation
33-109A
IBM T. J. Watson Research Center
Tie line 862-3183, Ext 914-945-3183
kung@us.ibm.com
Date: Tue, Jun 8, 2010 at 12:23 PM
Subject: EDA Roadmap Workshop at the DAC (it's free)
To: DATC members <DATC_members%IBMUS@us.ibm.com>
There will be a an EDA Roadmap workshop at the DAC (on Monday) hosted by Dr. Juan-antonio Carballo (DATC past chair) and Prof. Andrew Kahng. The EDA Roadmap Workshop at DAC 2010 is the second in a series of forums for deep discussion around roadmapping issues related to the EDA industry. Leaders from semiconductor companies, consortia, and academia will huddle to analyze the need and state of the EDA sector's roadmapping efforts, with the goal of crafting a blank-sheet view of EDA roadmapping for the next 15 years. You can check out last year's presentation at http://vlsicad.ucsd.edu/EDARoadmapWorkshop
This event is guaranteed to be thought provoking and there is no charge for attendance. I will be giving my perspective on EDA roadmaps. Hope to see you there.
David
David S. Kung
Senior Manager, Design Automation
33-109A
IBM T. J. Watson Research Center
Tie line 862-3183, Ext 914-945-3183
kung@us.ibm.com
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