Quarterly tax deadline today for small business, so tired...

Did my Federal 941 for SS and Medicare, Colorado UI forms UITR-1 and UITR-1a, almost forgot 940 Federal Unemployment tax, which I think I had to do regardless of the amount because it was year-end.  In addition to the normal state and federal income taxes, which I can remember better.  Forgot that EFTPS (mandatory electronic) 941 payment takes a whole business day, and so no matter how early it is scheduled today, it is already late.  :-(   

(What is up with an electronic payment not being same-day, sheesh). 

Lucky the others can just be postmarked today.  :-)   

Keeping better records of the taxes I paid this time, hoping to do better with the next quarterly 4/30/11...  Also, I will pay the penalty when the notice arrives, and write a nice letter appealing the penalties, and hope for the best, it does work sometimes...

Cheers, 
Connie "Hope Springs Eternal" O'Dell 
Sr. Verification Specialist, Bookkeeper, 401K administrator, President, and Janitor

(kinda slacking off on the last)
c.odell@co-consulting.net 
303-641-5191 
_____________________________________________ 
CO Consulting - Boulder, CO - http://co-consulting.net

Intel finds chip design error ... SiliconValley.com

'... "Core i5" and "Core i7."

...affected chips aren't the main processors...but a support chip. The flaw means it may degrade with use over a period of months or years, slowing down the transfer of data to and from the computer's hard drives and DVD drives.

Intel said consumers can "continue to use their systems with confidence, while working with their computer manufacturer for a permanent solution." '

Intel finds chip design error, but raises revenue outlook - SiliconValley.com

IEEE GreenCom 2011 Call for Papers

Entirely on-line, as it should be...  :-)       link if cannot see below

Cheers, 
Connie O'Dell
c.odell@co-consulting.net 
303-641-5191 

---------- Forwarded message ----------
From: IEEE ComSoc Meetings <meetings@comsoc.org>
Date: Thu, Jan 27, 2011 at 2:35 PM
Subject: IEEE GreenCom 2011 Call for Papers

Problems viewing this message or on a mobile device? Click here.

Call For Papers The IEEE Online Conference on Green Communications (GreenCom) explores a new way of conducting scientific colloquia in an energy-efficient and environmentally friendly way. The conference will not only discuss latest research results in saving energy with "green" communications technology, but also be IEEE ComSoc's first "green" conference with very low CO2 emissions that is conducted on a single track entirely online without requiring participants to travel. IEEE GreenCom will cover a wide range of green communications including energy efficiency of communications as well as communications technologies for other green solutions such as smart grids, green buildings, and green logistics. The conference solicits original, unpublished research papers on the subsequently listed topics of interest. Both academic and industry contributions that report substantial results in green communications with a significant potential for energy savings are welcome. Topics of interest include, but are not limited to: Green Wireless and Fixed Line Communications • Energy-efficient protocols and extensions • Energy-efficient technology for network equipment • Energy-efficient communications management • Energy-efficiency in specific networks • Measurement & profiling of energy consumption Communications Technologies for Green Solutions • Transport and logistics • Industrial processes • Communications for energy efficient buildings • Energy harvesting Smart Grid Communications •Communications networks for Smart Grids •Demand-response •Distributed generation and storage For a detailed list of potential topics and submission instructions, visit http://www.ieee-greencom.org/submit.html. Important Dates Paper Submission Deadline: 20 March 2011 Acceptance Notification: 1 June 2011 Camera Ready Version Due: 1 July 2011

IEEE Communications Society - 17th floor , 3 Park Avenue, New York, NY 10016

DVCon: UVM Tutorial (Universal Verification Methodology)

Can't go, have too much work already, but maybe you can!

Cheers, 
Connie L. O'Dell 
Sr. Verification Specialist 
c.odell@co-consulting.net 
303-641-5191 
_____________________________________________ 
CO Consulting - Boulder, CO - http://co-consulting.net

---------- Forwarded message ----------
From: DVCon 2011 <news@mpassociates.com>
Date: Tue, Jan 25, 2011 at 12:49 PM
Subject: Invitation to Learn about Accellera's Universal Verification Methodology (UVM) from Experts at DVCon
 

Accellera's Verification Intellectual Property (VIP) committee members invite you to learn about our new Universal Verification Methodology (UVM™) directly from the experts during a daylong tutorial at DVCon. For a detailed agenda of the technical content, please click here. To register for this event and our Accellera luncheon and Town Hall session please click here.

 

Verification has evolved into a complex project that often spans internal and external teams, but the discontinuity associated with multiple, incompatible methodologies among those teams has limited their productivity.  The UVM standard addresses verification complexity and interoperability within companies and throughout the electronics industry for both novice and advanced teams while also providing consistency. It defines a standard for the creation, integration, and extension of the UVM Verification Component (UVC) and the verification environments that scale from block to system. Accellera's VIP committee has been working hard to create the UVM for the past 18 months. Expert users, methodology engineers and tool developers have put together not just the standard specification but also a source code reference implementation for immediate deployment in complex SoC verification projects. Our tutorial will be presented by those experts.

 

Between the introductory and Transaction Level Modeling (TLM) sessions in the morning and the phasing and registers sessions in the afternoon, please join us for our lunch time Town Hall discussion on the UVM, SystemC and Transaction Level Modeling (TLM). A combined UVM and SystemC panel of experts will field questions and provide insights into how to bridge the abstraction gap between system-level verification and implementation level environments.  

You can find out more about UVM by visiting http://www.accellera.org/activities/vip.  

 

See you at DVCon.

Shishpal Rawat, Accellera Chair

Looking for SystemC processor design experience, also SystemC Day, Feb 28 at DVCon

Hi,

   If you have a SystemC/processor design/computer architecture background, and are interested in full-time employment for a startup, I know some people that would like to speak with you about an opportunity.  Colorado or Massachusetts are preferable, but other locations might work for the right person.

If you are just interested in getting started in SystemC, well, you should still contact me if you have design verification experience, but you may also find the following event interesting.  I would go, I always learn something cool at DVCon, but time is in short supply these days.  :-)

Cheers, 
Connie L. O'Dell 
Sr. Verification Specialist 
c.odell@co-consulting.net 
303-641-5191 
_____________________________________________ 
CO Consulting - Boulder, CO - http://co-consulting.net

---------- Forwarded message ----------
From: DVCon 2011 <news@mpassociates.com>
Date: Thu, Jan 20, 2011 at 1:12 PM
Subject: Users Meet at SystemC Day, Feb 28 at DVCon

Join Us for SystemC Day 2011 2nd Annual Event Co-located with the 2011 Design and Verification Conference (DVCon)         Registration Now Open! NASCUG 15 Meeting and Lunch Free to industry professionals; seating is limited, so register early Register Now >> DVCon Tutorial The tutorial requires separate registration and $75 fee Register Now >> Monday, February 28 DoubleTree Hotel, San Jose, California www.systemc.org The emergence of the SystemC standard set the stage in a new era of electronics design. Widespread adoption of SystemC is seen throughout the world and has provided a foundation for the electronics industry to innovate in a number of areas including design, verification, modeling and synthesis. Please join us at this special one-day event as we examine SystemC innovation. Hear from experts on the newest advancements in sustainable and flexible solutions for system-level design including the transaction-level modeling standard, OSCI TLM-2.0. Devised to bridge the system design gap between hardware and software, TLM-2.0 is now a substantial part of the new release of the IEEE-1666-2010 Standard for SystemC, and has spurred system design innovations in verification, virtual platform development, model interoperability, IP reuse, hardware/software co-design, high-level synthesis and many other areas. In addition, advancements made by the technical working groups will be presented including Analog/Mixed-signal; Configuration, Control and Inspection; Transaction-level Modeling; and Synthesis. Agenda       8:30 am - 12:00 pm   NASCUG 15 Meeting 10:00 am - 2:00 pm   Sponsor Tabletop Exhibits 12:00 pm - 1:30 pm   Complimentary Lunch 1:30 pm - 5:00 pm   DVCon Tutorial: "Software-Driven Verification Using TLM-2.0 Virtual Platforms" 5:00 pm   DVCon-Hosted Reception Details NASCUG 15, 8:30am - Noon The day starts off with the NASCUG 15 (North American SystemC Users Group) meeting featuring technical presentations on architectural modeling, verification, and analog/mixed-signal design using SystemC. An update of technical working group activities will be presented. Featured working groups include Transaction-level Modeling; Configuration, Control and Inspection; Analog/Mixed-signal; and Synthesis. www.nascug.org     Upcoming Event: SystemC AMS Day Industry adoption of the SystemC AMS standard May 12, 2011 Dresden, Germany Find out more >>     SystemC Showcase, 10:00am - 2:00pm The SystemC Showcase features tabletop exhibits from SystemC Day 2011 sponsors. Find out the latest tools, services and best practices for design and verification using SystemC. Complimentary Lunch, Noon - 1:30pm Courtesy of OSCI Sponsors and Accellera DVCon Tutorial, 1:30pm - 5:00pm "Software-Driven Verification Using TLM-2.0 Virtual Platforms" In this DVCon-featured tutorial, industry experts from the Open SystemC Initiative (OSCI), Accellera, and the user community will explore software-driven verification using SystemC TLM-2.0 virtual platforms and the standards-based methodologies in production today. Find out more >> DVCon-Hosted Reception, 5:00pm Thanks to Our Sponsors Open SystemC Initiative (OSCI), 1445 Foxworthy Avenue, Suite 50, PMB 132, San Jose, CA 95118

This message was sent from DVCon 2011 to c.odell@ieee.org. It was sent from: MP Associates, Inc., 1721 Boxelder Street, Suite 107, Louisville, CO 80027. You can modify/update your subscription via the link below. Email Marketing by

Manage your subscription

Engineering Family Day in DC, National engineer's week, career, &c: IEEE-USA Today's Engineer E-Mail Update: January 2011

Timely info for engineers.  

If you cannot see this message, here's a link: View this update in a Web browser

Cheers, 
Connie O'Dell 
c.odell@co-consulting.net 

---------- Forwarded message ----------
From: <IEEEservice@ieee.org>
Date: Tue, Jan 18, 2011 at 3:32 PM
Subject: IEEE-USA Today's Engineer E-Mail Update: January 2011

View this update in a Web browser

January 2011 Network with IEEE Members >>   IEEE-USA Today's Engineer Today's Engineer is a monthly online publication covering issues affecting U.S. IEEE Members' careers, as well as topics that are shaping legislation, the technology workplace, and the engineering world. The January 2011 issue includes these features: A Decade in Review: 2000-2010 Outlook for 2011 Hidden Job Market Secrets: The Right Strategy Makes Looking for a New Job Easy Ten Things You May Not Know About Social Networking and Social Networking Sites First Study of Its Kind Examines Innovation by U.S. Businesses Lame Duck Congress Passes Key Science and Technology Legislation IEEE-USA, IEEE Computer Society Cooperate in New Software Engineering Licensure Initiative Federal Government 101: The IEEE-USA Congressional and State Department Fellowships IEEE-USA Toolkit Tech Digest: January Your Engineering Heritage: IEEE and MIT World Bytes: Movies Can Teach Values   Introducing a new General Liability Insurance plan for home-based computer technologists. IEEE Professional Liability insured members who operate a computer-related professional services business out of their home are eligible for General Liability insurance so they can be protected against bodily injury, property damage, personal injury and advertising injury claims.   Upcoming Events Discover Engineering Family Day Hands-on and thought-provoking activities designed to expose children to engineering concepts and principles. 19 Feb 2011 Washington, DC 2011 National Engineers Week (EWeek) Celebrate the profession during EWeek. 20-26 Feb 2011 IEEE-USA Electric Vehicles & Personal Transportation Workshop A technical seminar on innovative solutions for maximizing energy efficiency in automobiles and transportation systems. 4 Mar 2011 Austin, TX 2011 IEEE-USA Annual Meeting The 2011 IEEE-USA Annual Meeting theme is Engineering in Motion. 3-6 Mar 2011 Austin, TX 2011 SET Congressional Visits Day Join us in Washington to help raise visibility and support for science, engineering and technology. 6-7 Apr 2011 Washington, DC 2011 IEEE Green Technologies Conference Exploring emerging technologies in alternative fuel, renewable energy, alternative vehicle power sources, and technologies to promote energy conservation. 14-15 Apr 2011 Baton Rouge, LA Reminders IEEE-USA Student Video Competition Submissions Due 21 Jan 2011 2012 IEEE-USA Government Fellowships Applications Due 18 Mar 2011   New & Notable IEEE-USA in ACTION Don't miss the fourth issue of IEEE-USA in ACTION -- your source for learning about IEEE-USA's programs, products, services and activities, and to find out what the organization is doing on behalf of U.S. IEEE members. New IEEE-USA E-Book: Technical Presentations Book 4 Learn how to supplement your presentation with effective PowerPoint slides or other visual aids in this final installment on planning, assembling and delivering effective technical presentations. Career Resources IEEE-USA Career Navigator IEEE Job Site IEEE-USA Employment & Career Strategies Forum IEEE Education & Careers Resources for At-Risk Members Career Webinars   About the Today's Engineer E-Mail Update The Today's Engineer E-Mail Update is prepared monthly by IEEE-USA staff. Questions or comments about this E-Mail Update should be directed to: todaysengineer@ieee.org. Managing Editor: Greg Hill g.hill@ieee.org Managing Your Subscription U.S. members who have provided an e-mail address are automatically subscribed to the Today's Engineer E-Mail Update as a member benefit. If you would like to be removed from this distribution please Unsubscribe from List. Click here to update your subscriber preferences. If you have unsubscribed in error, please Subscribe to List. To unsubscribe from all mailings, use your IEEE Web Account to update your "Personal Profile and Communication Preferences." Replies to this message will not reach IEEE. Due to local e-mail service/provider settings, random characters may appear in some correspondence. To update your IEEE e-mail alias: http://eleccomm.ieee.org.